New metal/superconductor-insulator transitions and their effects on high-tc superconductivity in underdoped and optimally doped cuprates
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Karagandy University of the name of acad. E.A. Buketov
Abstract
A new approach to the metal/superconductor-insulator transition in doped cuprates by studying
the polaron formation and localization of doped charge carriers (holes) in them and the possibility of
transforming a metallic or superconducting system into an insulator was developed. A more suitable criterion for
such a phase transition by comparing the bandwidth (or Fermi energy) of large polarons with their binding
energies in the cuprates was derived. The possibility of the metal/superconductor-insulator transition and phase
separation in doped cuprates resulting in the formation of competing metallic/superconducting and insulating
phases in underdoped, optimally doped and even in overdoped high-Tc cuprates was predicted. Then the possible
detrimental and beneficial effects of the different disorders (e.g. polaron formation and charge-density-wave
transition) and the coexisting insulating and superconducting phases on the critical temperature `a of the
superconducting transition of underdoped and optimally doped cuprates was examined. The actual
superconducting transition temperature `a in these materials using the theory of Bose-liquid superconductivity,
and not the Bardeen-Cooper-Schrieffer-like theory of Fermi-liquid superconductivity, which is incapable of
predicting the relevant value of `a in high-`a cuprates was determined. We find that the suppressing of the
polaronic and charge-density-wave effects in optimally doped cuprates results in the enhancement of `a, while
some lattice defects (e.g., anion vacancies) in the cuprates may strongly affect, on `a and enhance high-`a
superconductivity in them.
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Kurbanov U.T. New metal/superconductor-insulator transitions and their effects on high-tc superconductivity in underdoped and optimally doped cuprates/U.T. Kurbanov, G.K. Zhumabaeva,S. Dzhumanov//Eurasian Physical Technical Journal. – 2024- Vol.21 - № 1(47). – pp.21-27.